玻璃焊料封装FBG温度传感特性研究

Research on temperature sensing characteristics of FBG packaged with glass solder

摘要:

针对传统胶粘剂封装的光纤布拉格光栅（FBG）温度传感器长期使用会出现老化、蠕变等问题，提出了一种新的金属封装FBG传感器温度增敏结构和封装工艺。通过有限元分析方法对传感器进行应变不敏感设计，使用玻璃焊料代替传统环氧树脂胶粘剂将FBG与不锈钢基底进行两点式焊接固定，并使用金属外壳与硅橡胶进行密封保护。在-20~55 ℃内，所制作的FBG温度传感器温度灵敏度27.46 pm/℃，线性拟合度均达到0.999，温度稳定性和可重复性良好。其在0~150 ℃的大温度范围内测量标准差小于0.003 ℃，且保持了良好的温度稳定性和重复性。该封装结构的传感器工艺简便、成本低、易于实现，其在结构健康监测领域有着很好的应用前景。

Abstract:

A new temperature sensing structure and packaging process for metal encapsulated fiber Bragg grating (FBG) temperature sensors are proposed to address the issues of aging, creep, and other issues that may arise from long-term use of traditional adhesive encapsulated FBG temperature sensors. Strain insensitive design of the sensor was carried out using finite element analysis method. Glass solder was used instead of traditional epoxy resin adhesive to fix the FBG and stainless steel substrate through two-point welding, and a metal shell and silicone rubber were used for sealing protection. Within -20~55 ℃, the temperature sensitivity of the FBG temperature sensor is 27.46 pm/℃, and the linear fitting degree reaches 0.999. The temperature stability and repeatability are good. It has a measurement standard deviation of less than 0.003 ℃ in the large temperature range of 0~150 ℃, and maintains good temperature stability and repeatability. The sensor technology of this packaging structure is simple, low-cost, and easy to implement, and it has good application prospects in the field of structural health monitoring.