Abstract:Wireless communication systems will deploy higher frequency bands to meet their development needs, such as high performance, miniaturization, and diversification, in the future. Radio frequency (RF) technology is the foundation for implementing wireless communication systems and directly determines the performance of the entire communication system. Glass has excellent high-frequency electrical performance, high stability and other advantages, and the surface high-density forming technology for fine metal wire and high-reliability processing technology for large aspect ratio through hole are becoming increasingly mature. Therefore, it is gradually being widely used as a substrate material for advanced packaging of RF systems and passive RF components. This article provides a systematic overview of the latest research progress on glass in three RF packaging technologies: chip back loading, chip embedding, and 3D stacking, as well as five passive RF components: transmission lines, interconnect lines, filters, phase shifters, and antennas. Different advanced packaging structures and passive RF components are analyzed from the perspectives of structural integration, process feasibility, and RF performance, and the corresponding challenges are also analyzed. Finally, the future development direction of glass-based RF systems was discussed from the aspects of optoelectronic co-packaging, SOP integration, and efficient heat dissipation.
