玻璃焊料封装FBG温度传感特性研究

Research on Temperature Sensing Characteristics of FBG Packaged with Glass Solder

摘要:

针对传统胶粘剂封装的光纤布拉格光栅(FBG)温度传感器长期使用出现的老化、蠕变等问题,提出了一种新的金属封装FBG传感器温度增敏结构和封装工艺。通过有限元分析方法对传感器进行应变不敏感设计,使用玻璃焊料代替传统环氧树脂胶粘剂将FBG与不锈钢基底进行两点式焊接固定,并使用金属外壳与硅橡胶进行密封保护。在-20~55℃温度变化范围内,所制作的FBG温度传感器温度灵敏度为27.46pm/℃,线性拟合度均达到0.999,温度稳定性和可重复性良好,其在0~150℃的大温度范围内测量标准差小于0.003℃,也保持了良好的温度稳定性和重复性。该封装结构的传感器工艺简便、成本低、易于实现,其在结构健康监测领域具有广阔的应用前景。

Abstract:

A novel temperature sensing structure and packaging process for metal-encapsulated fiber Bragg grating (FBG) temperature sensors were proposed to overcome issues such as aging, creep, and other long-term effects typically seen in traditional adhesive-encapsulated FBG temperature sensors. Finite element analysis was used to design a strain-insensitive sensor. In this new design, glass solder replaced traditional epoxy resin adhesive to secure the FBG to a stainless steel substrate through two-point welding, while a metal shell and silicone rubber provided sealing protection. The FBG temperature sensor demonstrated a temperature sensitivity of 27.46pm/℃ within the range of -20 to 55℃, with a linear fitting degree of 0.999. The sensor exhibited excellent temperature stability and repeatability, achieving a measurement standard deviation of less than 0.003℃ across a broader temperature range of 0 to 150℃. This packaging structure offers a simple, cost-effective, and easily implementable sensor technology, with promising application prospects in the field of structural health monitoring.