功能梯度压电半导体拉-弯梁的屈曲分析

Buckling Analysis of a Functionally Graded Piezoelectric Semiconductor Extension-flexure Beam

摘要:

本文基于三维压电半导体理论和一阶剪切变形理论,考虑材拉伸、弯曲和剪切耦合变形,建立了功能梯度压电半导体拉-弯梁在轴向压力作用下的屈曲模型。借助有限元分析软件COMSOL对压电半导体拉-弯梁进行稳定性进行分析,得到了功能梯度压电半导体简支梁的前三阶屈曲临界载荷及各机电场的分布规律。通过数值算例,讨论了梁长高比、初始电子浓度和功能梯度参数等对压电半导体拉-弯梁屈曲临界载荷的影响。

Abstract:

Based on the theories of three-dimensional piezoelectric semiconductor (PSC) and the first-order shear deformation, considering the coupling extension, flexure and shear deformations, a buckling model for a one-dimensional functionally graded PSC extension-flexure beam is established. The stability of the functionally graded PSC extension-flexure beam under an axial load is analyzed via finite element analysis software COMSOL, the first three critical buckling loads and distributions of the electromechanical field for a simply supported beam are obtained. The influences of the beam length-height ratio, initial electron concentration and functionally graded parameters on critical buckling loads are discussed according to some numerical examples.