短波红外探测器金丝键合工艺优化分析

Optimization analysis of gold wire bonding process of shortwave infrared detector

摘要:

金丝键合技术是红外探测器制造必不可少的封装技术,用来实现器件芯片与板级电路的电学信号互联。为探究适用于不同应用需求的短波红外焦平面探测器,本文分析红外焦平面探测器键合工艺给出工艺实施的注意事项。采用25μm金丝,以键合结果符合国军标要求为基本目标,给出超声压力、超声功率、超声时间范围,研究烧球之后超声焊接之前的接触力对键合可靠性与金丝拉力的影响,针对引线高连通率与高强度两类侧重,提出了差异化的键合参数优化设置,并使用探测器电学测试的统计结果做出了相应验证。

Abstract:

e andGold wire bonding technology is an indispensable packaging technology for infrared detector manufacturing, which is used to realize the electrical signal interconnection between device chips and board-level circuits. In order to explore the shortwave infrared focal plane detector suitable for different application needs, this paper analyzes the bonding process of infrared focal plane detector and gives the precautions for process implementation. Using 25um gold wire, taking the bonding results to meet the requirements of the national military standard as the basic goal, the ultrasonic pressure, ultrasonic power and ultrasonic time range are given, the influence of the contact force before ultrasonic welding after the burning ball on the bonding reliability and the gold wire tension is studied, and the optimization settings of the bonding welding parameters are proposed for the two types of high connectivity rat high strength of the leads, and the statistical results of the detector electrical test are verified accordingly.