硅基光子芯片研究进展与挑战

Progresses and Challenges of Silicon-based Photonic Chips

摘要:

硅基光子芯片以光子为信息传输媒介,具有高带宽、高速率、高集成度,及与CMOS工艺兼容等优点,在多个领域具有应用价值。文章首先介绍了几种硅基光子芯片的加工平台,包括绝缘体上硅(SOI),SiN,Ⅲ-Ⅴ族材料(如GaAs和InP)和硅衬底上铌酸锂薄膜,然后回顾了硅基光子芯片在光通信与光互连、光计算、生物传感、激光雷达(LiDAR)和光量子领域的发展现状和挑战,最后进行了总结。

Abstract:

Silicon-based photonic chips use photon as the information transmission media, which has the advantages of broad bandwidth, high speed, high integration and compatibility with CMOS technology, and has application value in many fields. In this paper, first, several manufacturing platforms of silicon-based photonic chips are introduced, including silicon-on-insulator (SOI), SiN, Ⅲ-Ⅴ compound materials (such as GaAs and InP) and lithium niobate film on silicon, then the development status and challenges of silicon-based photonic chips are reviewed in the fields of optical communication and interconnection, optical computing, biosensors, light detection and ranging (LiDAR)and quantum photonics, and finally, a summary is presented.