基于热-流-力耦合计算的多芯片组件布局构形优化

Constructal Optimization for The Layout of Multi-Chip Module Based on Thermal-Flow-Stress Coupling Calculations

摘要:

基于构形理论和多物理场耦合数值计算方法,建立了自然对流条件下均匀产热的多芯片组件模型,给定印刷电路板面积和芯片总占地面积为约束条件,分别以最高温度、最大应力和最大形变为优化目标,以芯片个数及芯片长宽比为设计变量,研究了芯片布局演化对系统性能的影响。结果表明:不同优化目标下,最优构形均为芯片长宽比为2.1的8芯片布局方式,多芯片组件的最高温度、最大应力和最大形变分别最多可降低16.5%,28.3%和26.9%。对芯片个数和芯片长宽比双自由度的优化效果要明显优于仅对芯片长宽比的单自由度优化。

Abstract:

Based on the constructal theory and the numerical calculation method of multi-physical field coupling, the multi-chip module was established with uniform heat generation under natural convection. By taking the maximum temperature, maximum stress and maximum deformation as optimal objects, and taking the number of chips and the ratio of chip length to width as the design variables, the influences of chip layout evolution on the system performance are discussed under the total area constraints of printed circuit board and chips. The results show that the constructal optimization is an 8-chips layout with a chip aspect ratio of 2.1 under different performance indicators. The maximum temperature, maximum stress and maximum deformation of the multi-chip module can be reduced by up to 16.5%, 28.3%, and 26.9%, respectively. The effect of two degree of freedom optimization on the number of chips and the ratio of chip length to width is obviously better than that of single degree of freedom optimization only on the ratio of chip length to width.