High-quality GaN heteroepitaxy films were realized by using nitrogen plasma pretreatment of the sapphire substrate prior to the plasma-enhanced atomic layer deposition (PEALD) at 320℃. The crystal structures, surface morphology, elemental composition of the deposited GaN films were characterized by XRD, SEM, AFM and XPS. The results show that GaN films grown on the pretreated substrate exhibit improved crystalline quality with highly-preferred (002) growth direction. The as-grown GaN films are n-type with a carrier concentration up to 1.876×1019cm-3, resistivity of 2.551×10-2Ω·cm and the hole mobility of 13.04cm2·V-1·s-1. Most Ga elements form GaN with Ga-N bonds.