Abstract:A microwave transmission line with low transmission loss and low crosstalk was designed for the packaging of integrated light source array. A bridge-type microwave transmission line was obtained by analyzing the advantages and disadvantages of microstrip line and grounded coplanar waveguide. Simulations based on finite element method were used to optimize the structural parameters of the transmission line, and the results show that in the fequency range of up to 30GHz, the reflection coefficient of the transmission line is less than -17dB, the transmission loss is less than 0.4dB, and the crosstalk between adjacent lanes is less than -26dB. A package design for the array chip based on wire-bonding was presented, and the distance between the array chip and the transmission line was optimized.