Abstract:The performance of InGaAs/InP avalanche photodiode array is closely associated with the chip uniformity. The structure parameters mainly include the thickness of multiplication layer, the thickness and doping concentration of the charge layer, the thickness of the absorbtion layer and also the overbias of the devices. Their nonuniformity not only affects its properties such as breakdown voltage, dark count rate (DCR), photo detection efficiency (PDE), but also brings great challenges for subsequent readout circuits. In this paper, the influence of the structural parameters on Vbreak, DCR and PDE was analyzed. By controlling the volatility of Vbreak within ±1V as well as DCR and PDE within 10%, the maximum allowable fluctuation value of each structural parameter under different temperatures was obtained. The main factors related to the performance of devices were summarized, providing theoretical reference for the material growth and fabrication of large scale and high performance Geiger mode avalanche photodiode arrays.