三种光电外壳光窗封接工艺的强度对比分析

Contrast Analysis of Intensity of Optoelectronic Packages for Three Optical Window Capsulation Techniques

摘要:

从理论上分析了带光窗外壳的三种制作方式在成型变形上的不同, 并对各自进行了强冲击应力模拟分析, 最后通过锤击试验对理论分析进行验证, 实验结果与结论分析一致, 得出金属钎焊管帽抵抗外力的效果最好, 高温管帽次之, 高频管帽相对较差。

Abstract:

The difference of the shape deformation of optoelectronics packages produced by three kinds of optical window capsulation techniques was analyzed theoretically. The strong impact stress was analyzed with simulations. Lastly, pendulum-type impact test verifies the theoreticl analysis result.e. It is indicated that the resistance of soldering packages to strong impact is the best, that of pyrometallurgical-shape packages takes the second place, and the packages shaped by high-frequency is realitively weaker.