有限元分析在CCD制冷封装设计中的应用

Applications of Finite Element Analysis in CCD Cooling Package

摘要:

采用有限元分析方法对制冷封装CCD工作在低温时光窗外表面温度过低产生露珠的现象进行了研究, 分析了光窗与芯片表面(冷端)不同距离时光窗的最低温度以及内部填充不同气体时光窗的最低温度。通过有限元分析得到了光窗不产生露珠时的最优封装设计结构。

Abstract:

The phenomena of dewdrop induced by excessive low temperature in the cooling package process of CCD window was studied using the method of finite element analysis. The relationship between the lowest temperature on CCD window and the distance from the window to the chip surface was analyzed, and also the lowest temperature on the window with different filling gas in the package cavity was analyzed. And finally the optimum cooling package structure was obtained based on the analysis results.