大功率LED散热用微通道铝基板的有限元仿真

Simulation and Optimization of Micro-channel Al MCPCB for High-power LED Heat Dissipation

摘要:

对带微通道的铝基板上封装的不同功率LED,用Comsol Multiphysics软件对其温度场进行了有限元模拟,重点研究了微通道的孔大小、孔间距、绝缘层的厚度和热导率对基板散热性能的影响,结果表明:铝基板厚度为1.5mm左右,微通道方形孔,孔长0.8mm,孔间距0.8mm,绝缘层厚度50μm,热导率1.5W/(m·K),为最佳散热性能铝基板.微通道铝基板封装3W灯珠与普通铝基板和氮化铝基板相比,热阻分别下降了5.44和3.21℃/W,表明微通道铝基板能更好地满足大功率LED散热的需求.

Abstract:

The temperature field of different power LED packaged on Al matel core printed circuit board(MCPCB)were simulated and analyzed by Comsol multiphysics finite element software.The influence of aperture size and hole space of the microchannel substrate,thickness and thermal conductivity of the insulating layer on the heat dissipation of LED was studied.It is found that the best heat dissipation property of Al MCPCB was obtained at the combining conditions:the thickness of Al substate is 1.5mm,aperture size and hole space are both 0.8mm for the matel substrate microchannel,the thickness and thermal conductivity of the insulating layer is 50μm and about 1.5W·m-1·K-1,respectively.When packaged on 3W LED,the thermal resistence of the microchannel Al MCPCB is 5.44℃/W、3.21℃/W smaller than that of ordinary Al and AlN substrates,respectively,indicatinge that the Al MCPCB with microchannel can meet the need of heat dissipation in high-power LED package better.