Abstract:Thick 3D buffer layer consisting of low-temperature AlN nucleating layer,medium-temperature,gradual-temperature and high-temperature AlN growth layers was introduced to reduce the dislocation density and release the stress of AlN epitaxial layer grown on sapphire substrate.Optical microscope,atomic force microscopy (AFM) and X-ray diffractometer (XRD) were used to charactertize the samples,and the results indicate that the grown epitaxial layer presents no surface crack and distinct step flow morphology,the root mean square roughnesses (RMS) is 0.160nm,the KOH etch-pit density is 5.8×108cm-2,and the full-width at half-maximums (FWHM) of X-ray rocking curves (XRC) for (0002) and (10-12)plane is 210″ and 396″,respectively.The growth modes,dislocation behaviors and stress release for AlN epitaxial layer were discussed in detail.