芯片微通道换热器的数值模拟与分析

Numerical Simulation and Analysis of Chip Microchannel Heat Sinks

摘要:

由于水冷散热器体积小, 流体在散热器内流动形式复杂, 使散热器设计加工和性能测试在常规条件下有一定局限性。通过建立微通道水冷散热器三维模型, 运用ANSYS软件对影响散热器性能的因素(进口水温、环境温度、进口流速)进行了模拟分析, 得出了不同条件下芯片工作时的温度场分布, 为后续微通道水冷散热器的优化设计提供了理论依据。

Abstract:

Owing to the small volume of water-cooled heat sink and the complexity of flow form of the liquid, the design process and performance test of the heat sink are limited under normal conditions. In this paper, three-dimensional model of the microchannel water-cooled heat sink was established; some factors including inlet water temperature, environment temperature, inlet velocity which impact the performance of the heat sink were simulated and analyzed by ANSYS software. Temperature field distribution of the working chip is obtained for different conditions, which can provide some theory for the optimization design of microchannel water-cooled heat sinks.