电子器件热电制冷温度条件的优化

Optimization of Temperature Conditions of Thermoelectric Cooler for Cooling Electronic Components

摘要:

基于热电制冷热力学循环分析了热电制冷器正常工作的温度条件, 以及两种极限工况性能受工作温度条件的制约关系。优值系数是热电制冷器性能的内在制约, 散热和温度条件则是热电制冷性能的外在制约,热电制冷元件工作的温度特性与电子元件工作的理想温度条件是非常适应的。基于热电制冷的主动冷却技术对高热流密度电子集成部件的封装散热具有重大意义。

Abstract:

Based on the thermodynamic cycle, the temperature conditions for normal operations of thermoelectric refrigeration were analyzed, and the temperature restrictions for two limiting conditions were studied. The figure of merit and heat dissipation are respectively the internal and external restriction to the performance of thermoelectric refrigeration, and the temperature properties are consistent to the ideal temperature condition of electronic components. Active cooling technology based on thermoelectric refrigeration is of great significance to the heat dissipation of integrated electronic components with high heat flux.