基于ANSYS分析温度对荧光粉发光性能的影响

Analysis on the Influence of Temperature on Phosphor Luminescent Properties Based on ANSYS

摘要:

采用有限元方法模拟了LED集成封装光源和LED远程荧光集成封装(LED RPIP)光源各部分的热量分布。通过结合模拟和实验数据分析得到: 随着LED结温升高, 荧光粉温度随之上升, 发光性能不断衰退, LED硅胶板和LED远程荧光板温度从室温35℃分别升高到73.794和73.156℃, 光源光通量分别降低了30.53和22.39lm。最后得出硅胶板和远程荧光板中荧光粉发光性能分别下降了0.943%和0.78%。

Abstract:

Finite-element methods were adopted to simulate the heat distribution of each part of the light sources. The simulation and experimental data show that the temperature of phosphor increases and its luminescent property declines with the increase of LED junction temperature, meanwhile, the temperature of LED silicon pad and LED remote phosphor plate ascends from ambient temperature 35℃ up to 73.794 and 73.156℃, respectively, and the luminous flux reduces by 30.53 and 22.39lm separately. It can be concluded that the luminescent performance of phosphors in silicon pad and remote fluorescent plate is decreased by 0.943% and 0.78% respectively.