半导体激光阵列“Smile”效应下快轴准直镜的装调

"Smile" Effect on Fast Axis Collimator Assembly for Diode Laser Array

摘要:

针对3种典型“Smile”形态的半导体激光阵列(LDA)如何装调快轴准直镜的问题, 开展“Smile”条件下快轴准直实验定量研究。利用光纤近场扫描法和最小二乘法获得LDA的“Smile”值, 采用Zemax非序列模式, 模拟“Smile”下LDA的快轴准直。结果表明, LDA的“Smile”大小及形态分布影响准直镜装调位置, 透镜光轴需要与LDA匹配, 否则会造成光束质量的劣化。这为实际掌握LDA的快轴准直安装提供一种思路, 为进一步集成高功率高光束质量的大功率半导体激光器提供了理论和实验基础。

Abstract:

In order to study how to assemble fast axis collimator for three types of "Smile" shape diode laser array, theoretical and experimental quantitative researches on fast axis collimation were carried out. By fiber near-field scanning and least-squares method, the "Smile" value of the laser diode array (LDA) was obtained. And Zemax non-sequential mode was used to simulate the fast axis collimation of LDA with "Smile" effects. The results show that the "Smile" size and shape distributions of LDA affect the collimation result, and the "Smile" values must be controlled to obtain high energy efficiency and high beam quality of LAD. And the center of the lens is required to make a good match with LAD, otherwise it will cause deterioration of beam quality.