基于烟囱效应的集成封装半导体照明光源散热结构优化设计

Optimization of Heat Sink Design Based on Chimney Effect for Integrated Packaging Semiconductor Lighting Source

摘要:

针对基于集成封装发光二级管(COB LED)的半导体照明光源，研究了引流孔的形状、尺寸和位置等对基于烟囱效应的散热器的散热特性的影响。CFD仿真模拟表明，对于50W热功率的COB LED散热结构，在导热板上形成两个面积为15cm²、以光源中心对称的矩形引流孔，可在保持COB LED最高温度小于52℃的条件下，将基于烟囱效应的散热器的重量进一步降低15%。实验结果与模拟结果基本一致。

Abstract:

For semiconductor lighting source based on integrated packaging light-emitting diode (COB LED), the effects of shape, size and distribution of air conducting holes on the heat dissipation characteristics of chimney effect based heat sink are studied. It is indicated by CFD simulations that, for the heat dissipation structure of COB LED of 50W thermal power, by forming two rectangular air conducting holes of 15cm² symmetrically to the center of lighting source on the thermally conducting plate, the weight of the chimney effect based heat sink is further reduced by 15% while keeping the temperature of COB LED below 52℃. Experimental results and simulation results are basically consistent.