声表面波器件用粘片胶的试验研究

Research on the Chip Adhesive Used for SAW Devices

摘要:

针对目前声表面波器件用粘接剂固化时间长、小尺寸（面积小于10mm²），芯片剪切强度低的问题，测试分析了988粘片胶热稳定性、材料放气和胶成分；研究了在不同的固化工艺条件下，988胶粘片胶对声表面波器件的小尺寸芯片剪切强度和声表面波滤波器带外抑制的影响。测试和研究结果表明，采用988粘片胶能够缩短固化周期，满足国军标规定的芯片剪切强度的要求，同时能使滤波器性能得到提升。

Abstract:

For the problems that the curing time of chip adhesive used for surface acoustic wave (SAW) devices is very long, and its shear strength of the chip with less than 10mm2 areas (be called as small size in the below paper) is very low at present，the thermal stability, material deflation and adhesive composition of Type 988 adhesive are tested and analyzed. The influences of Type 988 adhesive on the shear strength of small size chip and the out band rejection of SAW filter are investigated under the different curing condition.The tested and investigated results show that the curing time could be shorten, the shear strength could meet the requirement of national military standard, and the properties of SAW filters could be enhanced by use of Type 988 adhesive.