基于SOPC的非致冷红外热成像系统的研制

Fabrication of Uncooled Infrared Imaging System Based on SOPC

摘要:

针对传统基于DSP+FPGA/CPLD架构的红外热成像系统存在体积大、数据传输链路长、功耗大等缺点,提出一种基于片上可编程(SOPC)的非致冷红外热成像系统。利用SOPC定制NIOSⅡ软核处理器、存储控制器及外围电路等成像系统的硬件,并由NIOSⅡ软核实现红外图像的处理和显示,使系统软硬件高度集成在同一芯片内。与传统的红外热成像系统相比,基于SOPC的非致冷红外热成像系统具有体积小、功耗低、性能稳定的优点。 更多还原

Abstract:

As for the disadvantages of big size, long data link, large power consumption of traditional infrared thermal imaging system based on DSP+FPGA/CPLD, a novel solution of uncooled infrared thermal imaging systems based on System on Programmable Chip (SOPC)is proposed. Using SOPC can customize NIOS II soft-core processor, memory controller, the peripheral circuits and the other hardware components. Infrared image processing and display are realized by using NIOS II soft-core, which causes the system software and hardware to integrate highly in one chip. Compared with traditional infrared thermal imaging systems, the system owns characteristics of small size, low power consumption and stable performance.