FPA探测器微细间隙填充工艺研究

Research on Fine Pitch Underfill Process of FPA Ultraviolet Detector

摘要:

介绍了倒焊器件填充工艺原理,分析了胶水粘度、放置时间、填充温度和填充速度对填充效果的影响。在常温条件下,选用的胶水放置时间不超过1h,填充速度为0.20mg/min时,FPA(焦平面阵列)探测器有效区域的填充率达到100%,测试合格率大于95%。

Abstract:

Based on introducing the underfill process of flip chip, the effects of such factors as glue viscosity, processing temperature, storage period and flow speed on the underfill quality were analyzed. Experimental results show under room temperature, the filling rate of adhesive in FPA ultraviolet detector achieves 100% under the conditions of storage time of less than 1 hour and flow speed of 0.2mg/min. 95% the devices pass the electrical parametric testing.