基于主动红外的倒装芯片缺陷检测研究

Research on Defect Inspection of Flip Chip Using Active Thermography

摘要:

传统的倒装芯片无损检测技术并不能完全满足倒装焊检测需要,为此提出了一种基于主动红外的倒装芯片缺陷检测方法。通过非接触方式对倒装芯片施加热激励,并结合红外测温设备检测芯片温度分布情况,从而对芯片内部缺陷进行诊断与识别。实验研究表明,该方法能较好地检测出倒装焊点缺陷,可应用于倒装焊芯片的缺陷检测与诊断研究。

Abstract:

Traditional non-destructive detection methods owing to their disadvantages are insufficient for solder joint assessment.Therefore,a defect inspection method based on active thermography is proposed in this paper.In this approach,the flip chip is heated by non-contact thermal source.A commercial infrared thermal imager is employed to capture the thermal distribution on the chip.The thermal distribution and evolution indicate defects inside flip-chip.Experimental investigation is carried out.The results prove...