LED远程封装光学研究现状

Research Status of LED Remote Package Optics

摘要:

通过蓝光芯片荧光粉转换及三基色混光合成的白光LED照明等产品已得到了广泛应用, 但目前LED照明等产品还存在着光强、光形和色温等分布不均匀的问题。针对近期通过荧光粉本身粒度控制及分布控制、远程平面荧光涂层、球形荧光涂层、TIR棱镜集成及混光匀光等方式, 改进了LED封装的工艺和技术, 通过二次光学设计改善了LED封装中的光强、光形、色温分布等, 并对相关光学研究的进展进行了综述。

Abstract:

For widely used LED products, unevenly light distribution exists on intensity, light shape and color temperature. Recent researches of LED light intensity, light shape, color temperature distribution by phosphor granularity control and distribution control, remote spherical and other fluorescent phosphor coating, integrated TIR prism, mixed dodging light, etc., and progresses obtained by the second optical design to improve the intensity, light shape, color temperature and other optical researches in LED packaging technologies are reviewed.